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Effect of particle deposition and wet/dry cleaning methods on particle removal efficiency
- Kim, Tae Gon;
- Hu, Shan;
- Busnaina, Ahmed.A.;
- Park, Jin-Goo
Citations
SCOPUS
2초록
The effect of wet/dry deposition methods and wet/dry cleaning methods on particle removal efficiency (PRE) was investigated. PRE strongly is strongly dependent on particle deposition and removal methods. IPA deposition method was easier to remove silica and PSL particles than DI deposition method when a dry cleaning, a laser shock wave cleaning was applied. DI water deposited PSL particles on both oxide and silicon nitride wafers are much easier to remove than IPA deposited particles in wet cleaning by DI water. However, PRE of silica particles did not show dependency on deposition methods. © The Electrochemical Society.
키워드
(100) silicon; (OTDR) technology; Applied (CO); Cleaning methods; Deposition methods; DI water; Electrochemical Society (ECS); International symposium; Laser shock waves; particle depositions; Particle-removal efficiency (PRE); Semi-conductor cleaning; Silica particles; Surface conditioning; wet cleaning; Blood vessel prostheses; Chemicals removal (water treatment); Computer networks; Cubic boron nitride; Dry cleaning; Electric conductivity; Nitrides; Particle size; Photoacoustic effect; Pulsed laser deposition; Removal; Semiconductor device manufacture; Semiconductor device models; Semiconductor devices; Semiconductor materials; Semiconductor switches; Silica; Silicate minerals; Silicon; Silicon compounds; Silicon nitride; Silicon wafers; Surfaces; Technology; Waves; Surface cleaning
- 제목
- Effect of particle deposition and wet/dry cleaning methods on particle removal efficiency
- 저자
- Kim, Tae Gon; Hu, Shan; Busnaina, Ahmed.A.; Park, Jin-Goo
- 발행일
- 2007-10
- 유형
- Conference Paper
- 저널명
- ECS Transactions
- 권
- 11
- 호
- 2
- 페이지
- 361 ~ 367
- 언어
- ENG
- 출판사
- Electrochemical Society, Inc.
- 발행국가
- 미국
- 분량
- 7 페이지
- ISSN
- E 1938-6737
P 1938-5862