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Electrochemical studies of Cu and Ti barrier during the CMP in TSV applications for 3D-Packaging
- 제목
- Electrochemical studies of Cu and Ti barrier during the CMP in TSV applications for 3D-Packaging
- 저자
- 박진구
- 발행일
- 2022-05-19
- 학회명
- Materials Research Society of Korea, Spring Conference, 2022
- 개최지
- 삼척