Advanced Substrate Design for Resolving Random Orientation Challenges in LED Chip Integration

초록

The fluidic self-assembly process enables the mass assembly of LED chips; however, when the P/N contact orientations are randomly arranged, it can be challenging to supply power effectively. In conventional methods, this issue has been addressed by designing and using specially fabricated chips with indistinguishable electrode orientations. However, this approach requires additional fabrication steps, reducing overall efficiency. To overcome this limitation, a structure is needed that allows stable power delivery while utilizing standard LED chips with predetermined P/N contact orientations. In this study, we propose a method that integrates through-silicon via technology and printed circuit board techniques to enable effective power supply to LED chips assembled through the fluidic self-assembly process. This approach enhances the efficiency of fluidic self-assembly research using conventional LED chips and provides a method for implementing LED displays without requiring additional fabrication steps.

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