Quantitative measurement of pattern collapse and particle removal force

Citations

SCOPUS

20

초록

The pattern collapse and the particle removal force should be quantitatively understood and measured to develop the effective cleaning process without pattern damages. The method of measuring these forces by atomic force microscope (AFM) was introduced in this paper. Pattern collapse forces of a silicon oxynitride (SiON), silicon oxide (SiO2) and photoresist (PR) line pattern were measured. The particle removal force was measured on a 100 nm PSL particle on silicon. The force for pattern collapse increased linearly as a function of pattern width. PR pattern requires a smaller force than the SiON and SiO2 pattern at the same line width. Particle removal force of aged PSL on hydrophilic Si surface was two orders smaller than the collapse force of same size of patterns. © The Electrochemical Society.

키워드

(OTDR) technology; Atomic Force Microscope (AFM); cleaning processes; International symposium; particle removal; Pattern collapse; Pattern damages; Quantitative measurements; Semi-conductor cleaning; silicon oxides; Silicon oxynitride (SiON); Surface conditioning; Blood vessel prostheses; Cleaning; Computer networks; Electric conductivity; Extreme ultraviolet lithography; Measurements; Nitrides; Nonmetals; Particle size; Semiconductor device manufacture; Semiconductor device models; Semiconductor materials; Semiconductor switches; Silicon; Silicon compounds; Surface cleaning; Surfaces; Technology; Semiconducting silicon
제목
Quantitative measurement of pattern collapse and particle removal force
저자
Kim, Tae Gon; Wostyn, Kurt L.; Mertens, P.; Busnaina, Ahmed.A.; Park, Jin-Goo
DOI
10.1149/1.2779371
발행일
2007-10
유형
Conference Paper
저널명
ECS Transactions
권
11
호
2
페이지
123 ~ 129