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Novel method for nano-surface analysis of Cu CMP chemicals by AFM and microfluidic chip system
- Ryu, Heon yul;
- Han, Kwang min;
- Cho, Byoung jun;
- Shima, Shohei;
- Hamada, Satomi;
- ... Park, Jin goo;
- 외 2명
Citations
SCOPUS
0초록
A new method for nano-surface analysis with selective surface treatment is presented in this paper. With this method, the surface of interest is treated with chemicals selectively by using fluidics chip and boundaries of treated surface were analyzed by atomic force microscope. Through measuring the surface level relative to the untreated region, chemical-surface interactions could be assumed. Well-known Cu CMP slurry chemical components such as citric acid, hydrogen peroxide, and benzotriazole were treated on the copper surface with the above-mentioned experimental set, then the etch depth, grown/adsorbed layer thickness, and surface roughness were characterized by AFM measurement. © VDE VERLAG GMBH Berlin Offenbach
키워드
Atomic force microscope; Cu slurry chemicals; Microfluidics chip; Selective surface treatment; Step height measurement; Atomic force microscopy; Copper; Fluidics; Surface analysis; Surface roughness; Benzotriazoles; Chemical component; Chemical surfaces; Copper surface; Layer thickness; Microfluidic chip; Selective surface; Untreated region; Surface treatment
- 제목
- Novel method for nano-surface analysis of Cu CMP chemicals by AFM and microfluidic chip system
- 저자
- Ryu, Heon yul; Han, Kwang min; Cho, Byoung jun; Shima, Shohei; Hamada, Satomi; Hiyama, Hirokuni; Kim, Tae gon; Park, Jin goo
- 발행일
- 2017-10
- 유형
- Conference Paper
- 저널명
- ICPT 2017 - International Conference on Planarization/CMP Technology
- 페이지
- 88 ~ 93
- 언어
- ENG
- 출판사
- VDE Verlag GmbH
- 발행국가
- 독일
- 분량
- 6 페이지