Fabrication and Ink-Jet Patterning of Copper Nanoparticles with Improved Dispersion Stability

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10

초록

Copper (Cu) nanoparticles as the metal nanoparticles in the conductive ink were synthesized using electrochemical reaction. This method is characterized as the synthesis process without any metal salts and the post-treatment of washing and drying. It means that it does not need to consider about oxidized and agglomerated metal nanoparticles during the extra treatments. The Cu nanoparticles were synthesized in the various conditions of electrolyte to investigate the mechanism of the synthesis reaction of Cu nanoparticles. And also, the synthesized Cu nanoparticles were controlled the dispersion stability with the addition of dispersion agent such as PVP and Dextran. Finally, it was achieved the ink-jet printed Cu patterns using the synthesized Cu nanoparticles, and examined the morphology of the patterns.

키워드

Ink-Jet Printing; Cu Nanoparticles; Conductive Ink; Electrochemical Reaction; PRINTING TECHNOLOGY; SILVER-NITRATE
제목
Fabrication and Ink-Jet Patterning of Copper Nanoparticles with Improved Dispersion Stability
저자
Lee, Kun-Jae; Kim, Namwoo; Hong, Sung-Jei; Lee, Kyu Bok; Lee, Dong-Jun; Oh, Je Hoon; Byun, Younghun; Choa, Yong-Ho
DOI
10.1166/jnn.2010.2307
발행일
2010-05
유형
Article; Proceedings Paper
저널명
Journal of Nanoscience and Nanotechnology
권
10
호
5
페이지
3350 ~ 3353