Introduction to subpressure-driven soft deformation method for removing inherent voids in green components manufactured by material extrusion

  • Im, Tae Hyeob
  • Oh Heungseok
  • Goh Byeonghwa
  • Kim Juyong
  • Lee Jai-Sung
  • ... 이선영
  • 외 1명
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초록

This study introduces a post -treatment process, the subpressure-driven soft deformation method, to reduce inherent voids in Material Extrusion (MEX) components. By subjecting printed green components to heat treatment under subpressure, the process enhances viscosity, effectively filling voids formed between deposited tracks. The average porosities of the samples sintered from the green components without and with soft deformation are calculated to be 3.55% and 2.36%, respectively. A comparison of the tensile strengths and fracture surfaces of the sintered samples with and without soft deformation treatment indicated that the sintered samples with soft deformation treatment exhibited narrower standard deviation for the various mechanical properties. Capillary rheometer calculations indicate feedstock viscosity to be between 450.34 and 1018.31 Pa s under subpressure, diminishing inter -track voids without sizeable dimensional changes. Molecular dynamics simulation demonstrates a 3.7 -fold increase in bond strength, indicating intertrack voids effectively eliminated. Reduced inter -particle distances facilitate necking, grain growth, and improved sintered density.

키워드

Material extrusion (MEX)Inherent voidsSubpressure-driven soft deformationAll-atom molecular dynamics simulations
제목
Introduction to subpressure-driven soft deformation method for removing inherent voids in green components manufactured by material extrusion
저자
Im, Tae HyeobOh HeungseokGoh ByeonghwaKim JuyongLee Jai-Sung최준명이선영
DOI
10.1016/j.heliyon.2024.e28689
발행일
2024-04
유형
Article
저널명
Heliyon
10
7