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The Effect of Thermal Aging on Nano-Particle Removal
- Kim, Yeoho;
- Jin, Seung-Wan;
- Kim, Hyun-Tae;
- Kim, Tae-Gon;
- Won, Kyu-Hwang;
- ... Park, Jin Goo
Citations
SCOPUS
0초록
The adhesion behavior of thermally aged particles was studied by characterizing the footprint, which could be formed between a particle and a substrate. To understand the formation mechanism of the footprint, the effects of temperature and aging time on the particle removal were studied. Understanding the particle adhesion and removal aged at high temperatures is important to maintain the cleanness of the wafer backside where many contaminants could adhere on in various wafer process chambers.
키워드
Cleaning; Footprint; Particle Defect; Thermal aging; Wafer backside
- 제목
- The Effect of Thermal Aging on Nano-Particle Removal
- 저자
- Kim, Yeoho; Jin, Seung-Wan; Kim, Hyun-Tae; Kim, Tae-Gon; Won, Kyu-Hwang; Park, Jin Goo
- 발행일
- 2021-02
- 유형
- 정기학술지(Article(Perspective Article포함))
- 권
- 314
- 페이지
- 228 ~ 233
- 언어
- KOR
- 출판사
- Scitec Publications Ltd.
- 발행국가
- 스위스
- 분량
- 6 페이지
- ISSN
- E 1662-9779
P 1012-0394