Thermal-Aware Design and Management of Embedded Real-Time Systems

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8
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10

초록

Modern embedded systems face challenges in managing on-chip temperature as they are increasingly realized in powerful system-on-chips. This paper presents thermal-aware design and management of embedded systems by tightly coupling two mechanisms, thermal-aware utilization bound and real-time dynamic thermal management. The former provides the processor utilization upper-bound to meet the chip temperature constraint that depends not only on the system configurations and workloads but also chip cooling capacity and environment. The latter adaptively optimizes rates of individual task executions subject to the thermal-aware utilization bound. Our experiments on an automotive controller demonstrate the thermal-aware utilization bound and improved system utilization by 18.2 % compared with existing approaches.

키워드

cooling; embedded systems; system-on-chip; thermal management (packaging)
제목
Thermal-Aware Design and Management of Embedded Real-Time Systems
저자
LEE, YOUNG MOON
DOI
10.23919/DATE51398.2021.9474042
발행일
2021-02
유형
Proceedings Paper
저널명
PROCEEDINGS OF THE 2021 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE 2021)
페이지
1252 ~ 1255