ScholarWorks@Hanyang University ERICA Campus

상세 보기

Study on the effect of copper ions on brush loading during post-Cu-CMP cleaning

제목
Study on the effect of copper ions on brush loading during post-Cu-CMP cleaning
저자
박진구
발행일
2021-10-29
학회명
Asian Workshop on Planarization/CMP Technology
개최지
온라인

ScholarWorks@Hanyang University ERICA Campus

(15588) 경기도 안산시 상록구 한양대학로 55 Tel. +82-31-400-4269

COPYRIGHT © Hanyang University ERICA Campus All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.