Contamination Removal From UV and EUV Photomasks

Citations

SCOPUS

5

초록

In semiconductor fabrication industries, photomask cleaning with no pattern damage is a critical issue, especially for advanced technology nodes. Thus, optimization of cleaning techniques adopted for photomask cleaning or development of new cleaning technique is always of great interest to meet process requirements. In this book chapter, the sources of contaminants on photomask and their impact on imprinted images are first discussed. Then a critical review is presented on the wide spectrum of cleaning techniques and strategies that are adopted for the removal of particulate contaminants and organics from the photomask. The applicability of each technique and its limitations are also examined. Because extreme ultraviolet lithography (EUVL) is considered to be a next-generation lithography, a separate section is devoted to EUVL mask-cleaning techniques. © 2017 Elsevier Inc. All rights reserved.

키워드

Aerosol cleaning; Cleaning techniques; EUVL mask; Jet spray cleaning; Megasonic cleaning; Organics removal; Ozone cleaning; Particle removal; Photomask; SPM cleaning; Extreme ultraviolet lithography; Masks; Photomasks; Aerosol cleaning; EUVL masks; Megasonic cleaning; Organics removal; Particle removal; Spray cleaning; Surface cleaning
제목
Contamination Removal From UV and EUV Photomasks
저자
Venkatesh, R. Prasanna; Kim, Min su; Park, Jin-Goo
DOI
10.1016/B978-0-323-43157-6.00005-7
발행일
2017-00
유형
Book Chapter
저널명
Developments in Surface Contamination and Cleaning
권
9
페이지
135 ~ 173