Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning

Citations

SCOPUS

8

초록

As the technology is going below 7 nm or still lower, pCMP (Post-CMP) cleaning is becoming a more critical step to reduce the defects generated from CMP process. PVA brush scrubbing is a vital technique used for pCMP cleaning to remove slurry particles and other polishing residues remained after CMP. Very recently PVA brush has become the most critical consumable to reduce the defect levels, as the brush itself has been found to be a source of several defects. Hence, it has become important to understand every aspect of PVA brush. In this chapter, a systematic explanation of PVA brush is provided starting with its preparation, design, kinematics and tribological effects. A special type of defects that might be generated from PVA brushes is summarized. A detailed explanation about the defect generation possibilities from PVA brushes and their analysis are provided. New techniques to reduce the defects are also discussed. © 2022 Elsevier Ltd All rights reserved.

키워드

Break-in; Conditioning; Defects; Impurities; Post CMP cleaning; PVA brush
제목
Latest developments in the understanding of PVA brush related issues during post CMP (pCMP) cleaning
저자
Yerriboina, Nagendra Prasad; Park, Jin-Goo
DOI
10.1016/B978-0-12-821791-7.00004-6
발행일
2021-01
유형
Book chapter
저널명
Advances in Chemical Mechanical Planarization (CMP)
페이지
591 ~ 627