A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors

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초록

Implementation of on-chip passive elements and efficient regulation schemes are key aspects of fully integrated dc-dc converter design. This paper presents a 50-MHz fully integrated buck converter equipped with packaging inductors. These inductors include parasitic inductances of the bonding wires and lead frames in the package. They have significantly better Q factors than the best on-chip inductors implemented on silicon. This paper also presents full-swing and low-swing gate drivers for efficient regulation of high-frequency switching converters. The low-swing driver uses the drop voltage of a diode-connected transistor and is applied in a fabricated converter to reduce the gate driving loss caused by the high switching operation. The proposed converter is designed and fabricated using a 0.13-mu m 1-poly 6-metal CMOS process. The fully integrated buck converter achieves 68.7% and 76.8% efficiency for 3.3 V/2.0 V and 2.5 V/1.8 V conversions, respectively, while providing a load current of 250 mA.

키워드

Bonding wire; fully integrated dc-dc converter; lead frame; low-swing gate driver; packaging inductor; DC-DC CONVERTER; STEP-DOWN CONVERTER; SERIES RESISTANCE; ON-CHIP; CMOS; DESIGN; OUTPUT; FILTER; ISSUES; LIMITS
제목
A 50-MHz Fully Integrated Low-Swing Buck Converter Using Packaging Inductors
저자
Ahn, Youngkook; Nam, Hyunseok; Roh, Jeongjin
DOI
10.1109/TPEL.2012.2192136
발행일
2012-10
유형
Article
저널명
IEEE Transactions on Power Electronics
권
27
호
10
페이지
4347 ~ 4356