상세 보기
Improvement of Copper Electrodeposition on Through-Glass Via (TGV) Interposer Glass Substrates Current with NiFeBuffer Layer
- 제목
- Improvement of Copper Electrodeposition on Through-Glass Via (TGV) Interposer Glass Substrates Current with NiFeBuffer Layer
- 저자
- 좌용호
- 발행일
- 2025-10-27
- 학회명
- ISIMP 2025
- 개최지
- 제주