A 60 GHz Compact Multidirectional-Beam Antenna-in-Package for Mobile Devices

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초록

This letter proposes a new concept of a compact multidirection-beam antenna-in-package (AiP) for mobile devices. The AiP is the first integration of three vertically polarized millimeter-wave endfire horn antennas and a broadside horn antenna on a single substrate to cover four directions. The antennas are able to connect to radio frequency integrated circuits (RFICs) situated in the cavity at the backside of the substrate using bond wires. The size of the fabricated AiP is 6 mm × 6 mm × 1.5 mm (=1.2λ0 × 1.2λ0 × 0.3λ0) including 0.3 mm thickness of RFICs. The impedance bandwidth (| {{S_{11}}} | < - \text{15 dB}) fully covers the 60 GHz band (57-66 GHz). The measured boresight gain of the endfire antenna and the broadside antenna is 5 dBi at 57 GHz and 6.3 dBi at 60 GHz, respectively. © 2002-2011 IEEE.

키워드

Antenna-in-package (AiP); Low-temperature co-fired ceramic (LTCC); Millimeter-wave (mm-wave); Multidirectional beam; MULTILAYER ORGANIC PACKAGE; PATCH ANTENNA; ARRAY; RADIATION; BROADSIDE
제목
A 60 GHz Compact Multidirectional-Beam Antenna-in-Package for Mobile Devices
저자
Kim, Hong Yi; Jang, Taehwan; Bae, Hong Hyun; Park, Chul Soon
DOI
10.1109/LAWP.2019.2939630
발행일
2019-11
유형
정기학술지(Article(Perspective Article포함))
저널명
IEEE Antennas and Wireless Propagation Letters
권
18
호
11
페이지
2434 ~ 2438