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A 60 GHz Compact Multidirectional-Beam Antenna-in-Package for Mobile Devices
- Kim, Hong Yi;
- Jang, Taehwan;
- Bae, Hong Hyun;
- Park, Chul Soon
WEB OF SCIENCE
21SCOPUS
26초록
This letter proposes a new concept of a compact multidirection-beam antenna-in-package (AiP) for mobile devices. The AiP is the first integration of three vertically polarized millimeter-wave endfire horn antennas and a broadside horn antenna on a single substrate to cover four directions. The antennas are able to connect to radio frequency integrated circuits (RFICs) situated in the cavity at the backside of the substrate using bond wires. The size of the fabricated AiP is 6 mm × 6 mm × 1.5 mm (=1.2λ0 × 1.2λ0 × 0.3λ0) including 0.3 mm thickness of RFICs. The impedance bandwidth (| {{S_{11}}} | < - \text{15 dB}) fully covers the 60 GHz band (57-66 GHz). The measured boresight gain of the endfire antenna and the broadside antenna is 5 dBi at 57 GHz and 6.3 dBi at 60 GHz, respectively. © 2002-2011 IEEE.
키워드
- 제목
- A 60 GHz Compact Multidirectional-Beam Antenna-in-Package for Mobile Devices
- 저자
- Kim, Hong Yi; Jang, Taehwan; Bae, Hong Hyun; Park, Chul Soon
- 발행일
- 2019-11
- 유형
- 정기학술지(Article(Perspective Article포함))
- 권
- 18
- 호
- 11
- 페이지
- 2434 ~ 2438
- 언어
- ENG
- 출판사
- Institute of Electrical and Electronics Engineers
- 발행국가
- 미국
- 분량
- 5 페이지
- ISSN
- E 1548-5757
P 1536-1225