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한국풍공학회지
ISSN
P 1226-7872 E 2713-9514
출판사
한국풍공학회
국가
SOUTH KOREA
발행 상태
비활성
데이터베이스 수록 정보
KCI 2009-2025 (17년)
KCI 등재 2015-2026 (12년)
KCI 등재후보 2001-2014 (14년)
전체 6건 중 1번부터 6번까지의 결과를 표시합니다.
2025
Article
In-Situ Analysis of Crack Propagation in Wire Bonds Causing Intermittent Failures in Electronic Systems with Liquid-Nitrogen Thermal Shock Testing
- Chang, Youngbin ;
- Waqar, Muhammad ;
- Baeg, Sanghyeon
- 2025-10
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Article
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel
- Waqar, Muhammad ;
- Chang, Young-Bin ;
- Park, HyeonU ;
- Baeg, Sanghyeon
- 2025-02
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2023
Article
Modeling of Practical Substrate Thickness in Multilayer Printed Circuit Board for Millimeter-Wave Packaging
- Lee, Dongmin ;
- Lee, Ahnwoo ;
- Kim, Minchul ;
- Choe, Wonseok ;
- Lee, Chungsik ;
- ... Kim, Junghyun ;
- 외 2명
- 2023-04
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Article
DDR4 Ball Grid Array Package Intermittent Fracture Effect on Signal Integrity
- Waqar, Muhammad ;
- Chang, Young-Bin ;
- Kwon, Junhyeong ;
- Kim, Jeong-Hwan ;
- Baeg, Sanghyeon
- 2023-01
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2020
Article
A New High-Frequency Characterization for Coupled Transmission Lines Fabricated on Lossy Organic Substrates
- Kim, Joonhyun ;
- Shin, Junggeun ;
- Lee, Donghun ;
- Eo, Yungseon
- 2020-02
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
2019
Article
IC Package Interconnect Line Characterization Based on Frequency-Variant Transmission Line Modeling and Experimental S-Parameters
- Kim, Joonhyun ;
- Eo, Yungseon
- 2019-06
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC