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이화성
Lee, Hwa Sung
ERICA 첨단융합대학
ERICA 신소재·반도체공학전공
연구분야
- Organic Electronics,
- Polymer Composite,
- Wearable Sensors,
- 고분자 복합체,
- 웨어러블 센서,
- 유기전자소자
자료 필터
자료유형
발행연도
2014 ~ 2027
2014 2027
키워드
언어
전체 155건 중 21번부터 30번까지의 결과를 표시합니다.
2025
Conference
Highly Stretchable, Linear, and Low-Hysteresis Dual- Stimuli Sensor for Strain and Pressure Based on a 1D Double-Helix Structured Yarns
- 2025-06-04
Conference
Sustainable Aqueous Emulsification of Polymer Semiconductors for Ecofriendly, Streamlined Organic Electronics
- 2025-06-04
Conference
Design of a Heterogeneous Stiffness Composite Substrate for High-Performance Stretchable Organic Field-Effect Transistors
- 2025-06-03
Article
Fabric-based flexible sensors for advanced wearable applications: development, characterization, and integration into human-machine interaction systems
- Zhao, Junchao ;
- Fu, Kaiwen ;
- Wang, Banghu ;
- Deng, Jiale ;
- Lee, Hwa Sung ;
- 외 2명
- 2025-06
- FLEXIBLE AND PRINTED ELECTRONICS
- IOP Publishing Ltd
Article
Non-Invasive, Non-Enzymatic Glucose Sensor Using Phenylboronic Acid with Reversible Glucose Interaction
- Khan Md. Rajibur Rahaman ;
- Park Jisu ;
- Hwang Taehoon ;
- Seo Jungyoon ;
- Lee Hwa Sung
- 2025-06
- BioChip Journal
- KOREAN BIOCHIP SOCIETY-KBCS
Article
Sustainable Aqueous Emulsification of Polymer Semiconductors for Ecofriendly, Streamlined Organic Electronics
- Hwang, Taehoon ;
- Kim, Yumin ;
- Seo, Jungyoon ;
- Park, Jisu ;
- Kang, Minsu ;
- ... Lee, Hwa Sung ;
- 외 7명
- 2025-05
- Small Structures
- WILEY
Article
A Monolithic Neuromorphic Device for In-Sensor Tactile Computing
- Du, Yi ;
- Yang, Lu ;
- Gong, Jiangdong ;
- Hu, Jiahe ;
- Liu, Jiaqi ;
- ... Lee, Hwa Sung ;
- 외 4명
- 2025-05
- The Journal of Physical Chemistry Letters
- AMER CHEMICAL SOC
Conference
High-Efficiency Heat Dissipation Coating Implemented with Stepwise Thermally Conductive Pathway using Polymer-Nanocoated Thermal Filler
- 2025-04-09
Conference
Enhanced Hydrolysis Resistance of Aluminum Nitride via Surface Treatment for High-Thermal-Conductivity Epoxy Composites
- 2025-03-21
Article
Development of a new type of highly effective etchant solution for glue residue in wafer-level packaging process
- Kim, Ha-Yeong ;
- Jekal, Suk ;
- Chu, Yeon-Ryong ;
- Lim,Jisu ;
- Kim, Jiwon ;
- ... Lee, Hwa Sung ;
- 외 3명
- 2025-03
- Journal of Industrial and Engineering Chemistry
- ELSEVIER SCIENCE INC