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자료 필터
자료유형
발행연도
1999 ~ 2026
1999 2026
키워드
언어
전체 412건 중 21번부터 30번까지의 결과를 표시합니다.
2023
Article
Optimizing Annealing Temperature Control for Enhanced Magnetic Properties in Fe-Si-B Amorphous Flake Powder Cores
- Kim, Hea-Ran ;
- Lee, Dongsup ;
- Yang, Sangsun ;
- Kwon, Young-Tae ;
- Kim, Jongryoul ;
- 외 2명
- 2023-12
- Metals
- MDPI
Article
Synthesis and magnetic properties of α″-Fe16N2 nanofibers prepared by an electrospinning method
- Kang, Minkyu ;
- Lee, Jimin ;
- Choa, Yong-Ho ;
- Park, Jihoon ;
- Kim, Jongryoul
- 2023-12
- Journal of Magnetism and Magnetic Materials
- ELSEVIER
Article
Structural and magnetic properties of Sb substituted LTP Mn-Bi annealed ribbons
- Kang, Minkyu ;
- Lee, Hansol ;
- Park, Jihoon ;
- Kim, Jongryoul
- 2023-12
- Journal of Magnetism and Magnetic Materials
- ELSEVIER
Conference
Effect of Cu Addition on Magnetic Properties and Microstructures of SmFe 11 Ti Alloys Prepared by Melt-Spinning
- 2023-05-18
Conference
Microstructural and magnetic properties of low-energy ball milled LTP-MnBi powders via melt-spinning and gas-atomization
- 2023-05-18
Conference
Enhanced magnetic properties of anisotropic SmCo5/Fe-Co composites prepared using ultrasound-assisted electroless plating
- 2023-05-18
Conference
A study on high frequency characteristic and magnetic properties of various hexaferrites
- 2023-05-17
Conference
Millimeter Wave EMI Absorbing Materials using Magnetic Loss of M-type Ferrite and Conductive Grid
- 2023-05-17
Article
Microstructural and magnetic properties of low-energy ball milled LTP-MnBi powders via melt-spinning and gas-atomization
- Kang, Minkyu ;
- Kim, Jongryoul
- 2023-05
- 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)
- Institute of Electrical and Electronics Engineers Inc.
Article
Effect of Cu Addition on Magnetic Properties and Microstructures of SmFe11Ti Alloys Prepared by Melt-Spinning
- Lee, Hansol ;
- Kim, Jongryoul
- 2023-05
- 2023 IEEE International Magnetic Conference - Short Papers (INTERMAG Short Papers)
- Institute of Electrical and Electronics Engineers Inc.