ScholarWorks@Hanyang University ERICA Campus

상세 보기

Novel Interconnect Processes for Advanced Semiconductor Packaging

제목
Novel Interconnect Processes for Advanced Semiconductor Packaging
저자
유봉영
발행일
2024-08-21
학회명
ISOCC 21st International SoC Design Conference
개최지
일본

ScholarWorks@Hanyang University ERICA Campus

(15588) 경기도 안산시 상록구 한양대학로 55 Tel. +82-31-400-4269

COPYRIGHT © Hanyang University ERICA Campus All Rights Reserved.

Certain data included herein are derived from the © Web of Science of Clarivate Analytics. All rights reserved.

You may not copy or re-distribute this material in whole or in part without the prior written consent of Clarivate Analytics.