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자료 필터
자료유형
발행연도
2008 ~ 2026
2008 2026
키워드
언어
전체 497건 중 1번부터 10번까지의 결과를 표시합니다.
2026
Article
Electrodeposition of Ni-Fe-based low CTE alloy for void-free through glass via filling to enhance the thermo-mechanical reliability of glass substrate
- Yang, Fan ;
- Park, Jungjoon ;
- Lee, Jinhyun ;
- Yoon, Sanghwa ;
- Yoo, Bongyoung
- 2026-09
- Journal of Materials Science & Technology
- ELSEVIER
Article
Resistance switching in palladium nanoscale pine-cone structures for hydrogen sensors with a focus on individual effects of hydrogen desorption and volume shrinkage in recovery states
- Hwang, Inseong ;
- Seo, Jinmyeong ;
- Yang, Fan ;
- Yoon, Sanghwa ;
- Park, Soobin ;
- ... Yoo, Bongyoung
- 2026-07
- International Journal of Hydrogen Energy
- PERGAMON-ELSEVIER SCIENCE LTD
Article
Novel Electrochemical Processes for Advanced Packaging
- 2026-06
- 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026
- Institute of Electrical and Electronics Engineers Inc.
Article
Electrodeposition of (111)-Oriented Cu Using Accelerator for Cu-Cu Direct Bonding
- Kim, Soojin ;
- Park, Jungjoon ;
- Han, Haneul ;
- Seo, Jinmyeong ;
- Yoon, SangHwa ;
- ... Yoo, Bongyoung
- 2026-06
- 2026 International Conference on Electronics Packaging and Hybrid Bonding Symposium, ICEP-HBS 2026
- Institute of Electrical and Electronics Engineers Inc.
Article
Current-Assisted Cu-Cu Bonding at Low Temperature: Process Window and Mechanism
- Kwak, Byungkwan ;
- Seo, Jinmyeong ;
- Han, Haneul ;
- Yoon, Sanghwa ;
- Yoo, Bongyoung
- 2026-06
- Proceedings - Electronic Components and Technology Conference
Conference
Current-Assisted Cu–Cu Bonding at Low Temperature: Process Window and Mechanism
- 2026-05-28
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