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Effective Methods Controlling Cu Overburdens for Cu RDL Process
- Park, Kimoon;
- Lee, Jinhyun;
- Yoo, Bongyoung
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2초록
Microcontact printing (μCP) and electrochemical polishing (ECP) were proceeded for the Cu overburden thickness reduction and Cu planarization during the redistribution layer process. The suppressing property of μCP and the polishing effect of ECP were confirmed by electrochemical analysis. Suppressing effect of top surface of trench was confirmed after the μCP and Cu filling, and the removal of Cu overburdens was also confirmed after the Cu filling and the ECP. © 2018 IEEE.
키워드
Electropolishing; FOWLP; Microcontact printing; RDL; SAM; Electrolytic polishing; Polishing; Electrochemical analysis; FOWLP; Micro contact printing; Planarization; Polishing effects; Redistribution layers; Suppressing effects; Thickness reduction; Electron device manufacture
- 제목
- Effective Methods Controlling Cu Overburdens for Cu RDL Process
- 저자
- Park, Kimoon; Lee, Jinhyun; Yoo, Bongyoung
- 발행일
- 2018-06
- 유형
- Conference Paper
- 저널명
- 2018 IEEE International Interconnect Technology Conference, IITC 2018
- 페이지
- 106 ~ 108
- 언어
- ENG
- 출판사
- Institute of Electrical and Electronics Engineers Inc.
- 발행국가
- 미국
- 분량
- 3 페이지
- ISSN
- E 2380-6338
P 0000-0000