Novel Electrochemical Processes for Advanced Packaging

초록

The rapid expansion of emerging applications, including AI, mobile platforms, automotive electronics, and industrial high-reliability systems, has imposed simultaneous demands for miniaturization, higher integration density, and improved reliability. Consequently, packaging technologies have become increasingly important for overall semiconductor performance. This paper reviews the technological significance of electroplating in advanced packaging, highlighting its key application domains and discussing future roadmap directions.

키워드