상세 보기
Additive-Free DC Electrodeposition of (111)-Oriented Nanotwinned Copper for Reliable Cu–Cu Bonding
- 제목
- Additive-Free DC Electrodeposition of (111)-Oriented Nanotwinned Copper for Reliable Cu–Cu Bonding
- 저자
- 유봉영
- 발행일
- 2025-11-05
- 학회명
- The 23rd International Symposium on Microelectonics and Packaging(ISMP)
- 개최지
- 한국