상세 보기
Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper
- 제목
- Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper
- 저자
- 유봉영
- 발행일
- 2022-06-29
- 학회명
- IITC (International Interconnect Technology Conference)
- 개최지
- 미국