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Electrodeposition of (111)-Oriented Cu Using Reducing Agent for Cu–Cu Direct Bonding
- 제목
- Electrodeposition of (111)-Oriented Cu Using Reducing Agent for Cu–Cu Direct Bonding
- 저자
- 유봉영
- 발행일
- 2025-11-06
- 학회명
- The 23rd International Symposium on Microelectonics and Packaging(ISMP)
- 개최지
- 한국