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Analysis of microstructure of Copper films Electrodeposited at Low temperature and High Current Density and Thermal Compression of Copper-to-Copper Direct Bonding
- 제목
- Analysis of microstructure of Copper films Electrodeposited at Low temperature and High Current Density and Thermal Compression of Copper-to-Copper Direct Bonding
- 저자
- 유봉영
- 발행일
- 2018-08-27
- 학회명
- INPEC 2018
- 개최지
- 대한민국, 한양대학교 ERICA