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Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method
- Kwak, Byungkwan;
- Lee, Jinhyun;
- Yoon, Sanghwa;
- Yoo, Bongyoung
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2초록
In this paper, an alternative copper-to-copper direct bonding method is investigated through electric current-induced bonding, which is the enhancement method for forming copper-to-copper bonding using electric current. Electric current has two driving forces for copper-to-copper bonding: joule heat caused by electric current and electron wind force. These factors influenced the bonding formation by momentum transfer and additional diffusivity to copper atoms, so the interface of each copper pad quickly disappeared. © 2023 IEEE.
키워드
Copper-to-copper direct bonding; Electric current; Three-dimensional integration
- 제목
- Copper-to-Copper Direct Bonding Process Using Current-Induced Enhancement Method
- 저자
- Kwak, Byungkwan; Lee, Jinhyun; Yoon, Sanghwa; Yoo, Bongyoung
- 발행일
- 2023-05
- 유형
- Proceedings Paper
- 저널명
- 2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC
- 권
- 2023-May
- 페이지
- 2120 ~ 2124
- 언어
- ENG
- 출판사
- IEEE
- 발행국가
- 미국
- 분량
- 5 페이지
- ISSN
- E 2377-5726
P 0569-5503