상세 보기
The enhancement of copper to copper direct bonding process using Current-induced bonding method.
- 제목
- The enhancement of copper to copper direct bonding process using Current-induced bonding method.
- 저자
- 유봉영
- 발행일
- 2022-11-10
- 학회명
- ISMP, International Symposium on Microelectronics and Packaging
- 개최지
- 한국