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자료 필터
자료유형
발행연도
2008 ~ 2026
2008 2026
키워드
언어
전체 498건 중 101번부터 110번까지의 결과를 표시합니다.
2022
Conference
Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper
- 2022-06-29
Conference
Study of Cu Electrochemical Polishing for Redistribution Layer Process of Wafer Level Packaging
- 2022-06-23
Conference
Synergistic Effect of Cobalt and Nitrogen on the Spent Coffee Grounds Derived Carbon as an Efficient Catalyst for Alkaline Hydrogen Evolution
- 2022-06-01
Article
Cu to Cu direct bonding with optimized self-annealing behavior of the electroplated copper
- Han, Hanuel ;
- Lee, Chaerin ;
- Park, Sangwoo ;
- Kim, Youjung ;
- Yoo, Bongyoung
- 2022-06
- 2022 IEEE International Interconnect Technology Conference (IITC)
- Institute of Electrical and Electronics Engineers Inc.
Article
Ru electrodeposition and behaviors of additives for advanced technology nodes
- Kim, Youjung ;
- Han, Haneul ;
- Lee, Jinhyun ;
- Yoo, Bongyoung
- 2022-06
- 2022 IEEE International Interconnect Technology Conference, IITC 2022
- Institute of Electrical and Electronics Engineers Inc.
Article
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
- Park, Kimoon ;
- Inoue, Fumihiro ;
- Derakhshandeh, Jaber ;
- Yoo, Bongyoung
- 2022-04
- Japanese Journal of Applied Physics
- IOP Publishing Ltd
Article
Factors influencing the deposition of the inverse shape of 3D metal printing using electrochemical deposition
- Kim, Hyng Rae ;
- Kim, Young-kuk ;
- Yoo, Bongyoung ;
- Yoon, Sanghwa ;
- Kim, Sung-bin
- 2022-04
- Progress in Additive Manufacturing
- SPRINGERNATURE
Conference
Synthesis of the Spent Coffee Grounds Derived Carbon for an Catalyst for Alkaline Hydrogen Evolution
- 2022-03-31
Article
Cu Electrochemical Polishing for RDL Process of FOWLP and Effects of Cu Overburden Profiles
- Park, Kimoon ;
- Lee, Jinhyun ;
- Kim, Youjung ;
- Yoon, Sanghwa ;
- Yoo, Bongyoung
- 2022-03
- ECS Journal of Solid State Science and Technology
- ELECTROCHEMICAL SOC INC