박진구

전체 949건 중 11번부터 20번까지의 결과를 표시합니다.

2025

Conference

Stabilization of polyvinyl acetal brushes via effective removal of intrinsic impurities through advanced cleaning techniques

Conference

Effect of wafer-brush relative velocity on non-uniform PVA brush wear and cleaning consistency in oxide post-CMP cleaning

Conference

Particle Removal Mechanism on 4H-SiC Surface by Comparison with Si Surface

Conference

Improved Particle Removal and Sub-Nanometer Roughness Control in 4H-SiC Wafers Using PVA Brush Conditioning

Conference

Chelation-Assisted Cleaning for Effective Removal of Al and Mn Contaminants on 4H-SiC Wafer

Conference

Effect of Azole-Free Inhibitors on Cu Dissolution in H2O2 based Wet Etching Solutions during Metal Hard Mask Removal: Experimental and Theoretical study

Article

Metal ion contamination and removal on oxide surfaces and polyvinyl acetal brushes during the tungsten post-CMP cleaning process

Article

Effect of the additives on controlling ceria-brush chemical bonding during post-CMP cleaning

Article

Interaction study of copper ions and polyvinyl acetal (PVA) brush during copper post-CMP cleaning: Experimental and density functional theory study

Conference

Chemical and Mechanical Factors Contributing to Brush Nodule Mark Formation During Post-CMP Cleaning

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박진구

연구분야

자료유형

발행연도

키워드

언어

Stabilization of polyvinyl acetal brushes via effective removal of intrinsic impurities through advanced cleaning techniques

Effect of wafer-brush relative velocity on non-uniform PVA brush wear and cleaning consistency in oxide post-CMP cleaning

Particle Removal Mechanism on 4H-SiC Surface by Comparison with Si Surface

Improved Particle Removal and Sub-Nanometer Roughness Control in 4H-SiC Wafers Using PVA Brush Conditioning

Chelation-Assisted Cleaning for Effective Removal of Al and Mn Contaminants on 4H-SiC Wafer

Effect of Azole-Free Inhibitors on Cu Dissolution in H2O2 based Wet Etching Solutions during Metal Hard Mask Removal: Experimental and Theoretical study

Metal ion contamination and removal on oxide surfaces and polyvinyl acetal brushes during the tungsten post-CMP cleaning process

Effect of the additives on controlling ceria-brush chemical bonding during post-CMP cleaning

Interaction study of copper ions and polyvinyl acetal (PVA) brush during copper post-CMP cleaning: Experimental and density functional theory study

Chemical and Mechanical Factors Contributing to Brush Nodule Mark Formation During Post-CMP Cleaning